Sendasi, JAPAN, 980-8579
Takafumi Fukushima received the B.S., M.S., Ph.D. degrees in Department of Materials Science and Chemical Engineering from Yokohama National University in 1998, 2000, 2003, respectively. From 2001 to 2003, he was a technical advisor at PI R&D Corporation in Yokohama. After that, he worked at Venture Business Laboratory of Tohoku University as a postdoctoral fellow for a year. From 2004 to 2009, he was an assistant professor at Department of Bioengineering and Robotics, and from 20010 to 2014, he was an associate professor at New Industry Creation Hatchery Center (NICHe), Tohoku University. He is currently working on many aspects of 3D and biomedical system integration at Department of Bioengineering and Robotics, Tohoku University as an associate professor. He was awarded the MRS Fall Meeting Symposium E (Materials and Technologies for 3-D Integration) award in 2008, the Second Prize of the German Innovation Award/the Gottfried Wagener Prize in 2010, and the Outstanding Paper Award of the 60th Electronic Components and Technology Conference (ECTC), in 2011, and many others. He served as a chair of “Advanced interconnect” of Solid-State Devices and Materials (SSDM) 2012 and 2013, and a member of the program committee of the ECTC since 2013, and so on.